Extol receives patent for revolutionary nanoSTAKE® plastic staking technology
Extol is pleased to announce that we have received a patent for our revolutionary nanoSTAKE plastic staking technology. This is Extol’s second patent for a staking technology that will change the manufacturing industry. NanoSTAKE was developed to tackle the challenge of staking small plastic bosses in tight, hard-to-fit locations while being safe to use on electronics and other sensitive applications. The closed-loop process is fast and easy to use thanks to the proprietary Smart Respond™ heating system that rapidly heats and cools the punch at the tip of the module.
If you’re not familiar with plastic staking, generally, the process heats and forms a plastic boss into a stake to mechanically capture another component. The methods of heating and forming vary based on which staking technology is being used. Here’s how the nanoSTAKE process works: The low-current (1.5 A), high-performance heater heats a punch to a programmed melt temperature in seconds. The punch pushes down on the boss and forms it into a stake. Once the punch reaches the correct height, it rapidly cools to a programmed release temperature allowing it to retract without sticking to the plastic. The whole process can happen in less than 5 seconds and can stake bosses as small as 0.5 mm.
Due to its small size, safety, indifference to material color, and easy operation, nanoSTAKE is a great solution for a wide variety of applications. Additional features include exporting data, validation mode, teach mode, and extensive quality monitoring. Here are just a few types of applications that benefit the most from the nanoSTAKE process:
- Automotive trim
- Medical devices
- And many more
If you are a manufacturer, you can use nanoSTAKE for your next project. Extol’s highly-skilled team builds custom automation equipment and turnkey machines that incorporate nanoSTAKE along with many other technologies. If you prefer to use a different machine builder, we also offer nanoSTAKE integration packages that allow integrators to add the technology to the machines that they build.